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Home / News

STMicroelectronics Announces 20-Year Sustained Availability for Popular Automotive Microcontrollers

China, September 12, 2025—STMicroelectronics has extended the long-term availability program for its widely used SPC58 automotive microcontrollers (MCUs) from 15 to 20 years, ensuring supply of both general-purpose and high-performance product lines through at least 2038. Within the general-purpose series, the SPC58 H-series featuring up to 10MB of non-volatile memory (NVM) for code and data storage will now be supported through at least 2041. Figure. 1 Luca Rodeschini, Group Vice President and Gener....
2025-09-12 15:40:28 1109
STMicroelectronics Announces 20-Year Sustained Availability for Popular Automotive Microcontrollers

ReVolt Brings Clean Energy Innovation to Hollywood

Charging innovator leverages power modules and renewable energy to significantly reduce carbon emissions in film production Star power may drive Hollywood's global buzz, but the true force behind massive box office returns remains largely unseen. Currently, most production companies still rely on noisy, environmentally harmful gasoline and diesel generators to power their sets. However, as production sites expand in scale and professional filming electronics grow increasingly complex, energy demands continu....
2025-09-10 14:42:46 1401
ReVolt Brings Clean Energy Innovation to Hollywood

Bourns' new shielded power inductor series features a metal alloy powder core, delivering high current handling capability and ultra-low DC resistance.

The Bourns® SRP3220A series complies with automotive-grade AEC-Q200 standards. Its design characteristics help reduce EMI, thereby enhancing performance and reliability in automotive applications. Figure. 1Bourns® SRP3220A Series Shielded Power Inductors with Metal Alloy Powder Cores September 2, 2025 - Bourns, a globally recognized leader in manufacturing and supplying electronic components for power, protection, and sensing solutions, introduces the new SRP3220A series of shielded power inductors....
2025-09-03 17:06:59 681
Bourns' new shielded power inductor series features a metal alloy powder core, delivering high current handling capability and ultra-low DC resistance.

Pickering Unveils World's First 20kV Customizable Reed Relay at SEMICON Taiwan 2025

August 2025, Clacton-on-Sea, UK — Pickering Electronics, a global leader in high-performance reed relays, will showcase its comprehensive semiconductor test relay portfolio at SEMICON Taiwan 2025, including the newly launched 600 Series customizable high-voltage reed relays. This series achieves up to 20kV withstand voltage between switch contacts and up to 25kV between switch and coil. Visitors can view the product at the UK Pavilion, Booth I3022/J3034, during the exhibition from September 10-12, 202....
2025-08-29 17:41:07 1503
Pickering Unveils World's First 20kV Customizable Reed Relay at SEMICON Taiwan 2025

Nordic Semiconductor introduces the new nPM1304 power management IC

Figure. 1 Oslo, Norway – August 26, 2025 – Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, has announced the launch of the nPM1304 power management IC (PMIC), now available for customer ordering and development. The nPM1304 PMIC features a highly integrated ultra-low-power solution and precise battery meter functionality, complementing Nordic’s award-winning nPM1300 PMIC. The nPM1304 supports charging currents as low as 4 mA, making it an ideal choice f....
2025-08-26 16:41:11 1001
Nordic Semiconductor introduces the new nPM1304 power management IC

QNX Launches QNX OS for Safety (QOS) 8.0 to Accelerate Development of Functionally Safe and Cybersecurity-Critical Embedded Systems

Shanghai, China — August 21, 2025 — QNX, a division of BlackBerry Limited, today officially released QNX® Operating System for Safety 8.0 (hereinafter referred to as “QOS 8.0”). This safety-certified foundational solution is built on the high-performance, next-generation microkernel architecture of QNX® SDP 8.0, simplifying the development and certification of functionally safe and cybersecurity-critical embedded systems across industries such as automotive, industrial manufa....
2025-08-21 15:55:41 1114
QNX Launches QNX OS for Safety (QOS) 8.0 to Accelerate Development of Functionally Safe and Cybersecurity-Critical Embedded Systems

Bourns Launches New Miniature Encoders, Combining High Reliability with Compact Design

The Bourns® PEC04, PEC05, and PEC06 series, with IP40 protection, provide rugged, space-saving position sensing solutions for a variety of electronic devices. Figure 1 August 18, 2025 – Bourns, a leading global manufacturer and supplier of electronic components for power, protection, and sensing solutions, has introduced the PEC04 Series 4 mm incremental miniature encoders, the PEC05 Series 5 mm incremental miniature encoders, and the PEC06 Model 6 mm incremental miniature encoders. These new Bou....
2025-08-18 14:50:57 858
Bourns Launches New Miniature Encoders, Combining High Reliability with Compact Design

ams Osram Launches Next-Gen OSTAR Projection Power LEDs for Brighter Projectors and Automotive HUDs

Shanghai, China, August 12, 2025 – ams-Osram (SIX: AMS), a leading global supplier of intelligent sensing and emitter solutions, today announced that its next-generation OSTARTM Projection Power LEDs are setting the standard for LED technology innovation for compact projection systems and even future head-up displays (HUDs). ams-Osram plans to test these products using the US automotive qualification standard AEC-Q102. Once completed, these LEDs will also be used in automotive projection systems. Thes....
2025-08-13 10:38:47 484
ams Osram Launches Next-Gen OSTAR Projection Power LEDs for Brighter Projectors and Automotive HUDs

Teradyne Introduces Next-Generation Memory Test Platform Magnum 7H for High-Bandwidth Memory (HBM) Chips

August 8, 2025, Beijing, China — Teradyne, a global leader in automated test equipment and robotics, announced the launch of its next-generation memory test platform, Magnum 7H, designed to meet the stringent testing requirements of high-bandwidth memory (HBM) chips integrated into GPUs and accelerators in high-performance generative AI servers. The Magnum 7H is specifically designed for large-scale HBM stacked die testing, featuring high parallel testing capability, high speed, and high precision. Le....
2025-08-08 14:57:19 1481
Teradyne Introduces Next-Generation Memory Test Platform Magnum 7H for High-Bandwidth Memory (HBM) Chips

Arteris to Provide FlexGen Intelligent Network-on-Chip (NoC) IP for AMD's Next-Generation AI Chiplet Designs

AMD to Adopt Arteris' FlexGen Intelligent NoC IP in Semiconductor Designs to Boost Product Performance and Energy EfficiencyShanghai, China, August 5, 2025—As AI computing demands reshape the semiconductor market, Arteris Corporation, a leading provider of system IP dedicated to accelerating system-on-chip (SoC) development, today announced that AMD, a global leader in high-performance and adaptive computing, has adopted FlexGen Network-on-Chip Interconnect IP for its next-generation AI chiplet design....
2025-08-05 09:54:53 1525
Arteris to Provide FlexGen Intelligent Network-on-Chip (NoC) IP for AMD's Next-Generation AI Chiplet Designs

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