Renesas Electronics Adds Capacitive Touch Functionality to Ultra-Low Power RA0 Series MCUs
BEIJING, China, September 17, 2025 - Renesas Electronics Corporation, a global supplier of semiconductor solutions, today announced the RA0L1 microcontroller (MCU) product family based on the Arm® Cortex®-M23 processor. This ultra-low-power series delivers industry-leading capacitive touch solutions for battery-powered devices, consumer electronics, home appliances, white goods, and industrial system controls, enabling rapid and cost-effective deployment. Figure. 1 Renesas' RA0 MCU series, launched.... 2025-09-17 17:18:24 521

Bourns Launches New Miniature Encoders, Combining High Reliability with Compact Design
The Bourns® PEC04, PEC05, and PEC06 series, with IP40 protection, provide rugged, space-saving position sensing solutions for a variety of electronic devices. Figure 1 August 18, 2025 – Bourns, a leading global manufacturer and supplier of electronic components for power, protection, and sensing solutions, has introduced the PEC04 Series 4 mm incremental miniature encoders, the PEC05 Series 5 mm incremental miniature encoders, and the PEC06 Model 6 mm incremental miniature encoders. These new Bou.... 2025-08-18 14:50:57 844

Teradyne Introduces Next-Generation Memory Test Platform Magnum 7H for High-Bandwidth Memory (HBM) Chips
August 8, 2025, Beijing, China — Teradyne, a global leader in automated test equipment and robotics, announced the launch of its next-generation memory test platform, Magnum 7H, designed to meet the stringent testing requirements of high-bandwidth memory (HBM) chips integrated into GPUs and accelerators in high-performance generative AI servers. The Magnum 7H is specifically designed for large-scale HBM stacked die testing, featuring high parallel testing capability, high speed, and high precision. Le.... 2025-08-08 14:57:19 1236
