BEIJING, China, October 15, 2025 — Teradyne, a global leader in automated test solutions and advanced robotics, today announced the launch of the Titan HP System-Level Test (SLT) platform, specifically designed for the cloud infrastructure and artificial intelligence (AI) markets. This innovative solution emerges in response to growing market demand for advanced technologies driven by continuous process node scaling and the emergence of new architectures.
As complex chips used in AI and cloud infrastructure deployments push the boundaries of power consumption and thermal management, SLT has become an indispensable part of high-volume manufacturing processes. Teradyne's Titan HP is specifically engineered to test these chips under real-world operating conditions and is already deployed in production at several major customers. The platform currently supports up to 2 kW of power and is scheduled for an upcoming upgrade to 4 kW. This means customers' current investments will also meet future, more demanding chip testing requirements.
“The launch of Teradyne Titan HP represents a major breakthrough in today's cutting-edge chip testing for AI and cloud infrastructure,” said Jason Zee, Vice President and General Manager of Teradyne's Integrated Systems Test Division. Our continuous innovation in thermal control and power delivery capabilities, combined with our world-class support team, ensures customers' next-generation chips achieve the ultra-high quality standards required."
Teradyne Titan HP's exceptional thermal control capabilities ensure chips meet stringent quality standards while achieving or exceeding expected yield levels. Key features include:
Multi-branch cold plate architecture: Simultaneously cools devices under test (DUT) and non-DUT components for comprehensive thermal management.
Asynchronous thermal control: Station-level thermal regulation adjusted via Proportional-Integral-Derivative (PID) algorithms delivers precise, efficient heat dissipation to prevent chip overheating.
DUT heater option: Enhances Automatic Temperature Control (ATC) accuracy for more precise thermal testing.
Teradyne Titan HP, as the world's leading SLT solution, delivers task-mode testing capabilities for next-generation cloud infrastructure and AI chips. Teradyne's comprehensive test equipment portfolio ensures outstanding test performance for every test insertion on every chip. Titan HP is a critical component of this portfolio, ensuring customers' capital equipment investments remain adaptable to evolving market demands.