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Home / News

ams OSRAM Launches New Laser Diode for Next-Generation Automotive Lidar Applications

Shanghai, China, 14 November 2025 – ams OSRAM, a global leader in lighting and sensing innovation, today announced the launch of a new five-junction edge-emitting laser diode, driving lidar system performance to new heights. The realisation of autonomous driving relies on sensor technology capable of delivering precise, reliable, and long-range detection at all times. Lidar systems operate independently of lighting conditions, continuously capturing three-dimensional environmental data to enable real-....
2025-11-14 15:33:18 1792
ams OSRAM Launches New Laser Diode for Next-Generation Automotive Lidar Applications

Hopewind Selects Wolfspeed to Power the Future of Wind Energy with Advanced Silicon Carbide Technology

11 November 2025, Durham, North Carolina, USA; Shenzhen, China; Shanghai, China — Wolfspeed, the global leader in innovative silicon carbide power solutions, today announced a collaboration with Hopewind, a global innovator in renewable energy solutions. The two companies are jointly advancing the development of next-generation wind power solutions by integrating Wolfspeed's cutting-edge 2.3 kV LM Pack modules into Hopewind's advanced, highly modular and lightweight 950 Vac wind power converters. Fig....
2025-11-11 16:03:27 593
Hopewind Selects Wolfspeed to Power the Future of Wind Energy with Advanced Silicon Carbide Technology

Infineon and SolarEdge Collaborate to Advance Efficient Power Infrastructure for AI Data Centres

[7 November 2025, Munich, Germany and Milpitas, California, USA] Infineon Technologies AG, a global leader in power semiconductors, and SolarEdge Technologies, a global leader in smart energy solutions, have announced a collaboration to advance the application of SolarEdge's Solid-State Transformer (SST) platform in next-generation artificial intelligence (AI) and hyperscale data centres. This partnership aims to jointly design, optimise, and validate a modular SST base unit ranging from 2 to 5 megawatts (M....
2025-11-07 16:25:25 1702
Infineon and SolarEdge Collaborate to Advance Efficient Power Infrastructure for AI Data Centres

Infineon Launches New Generation of Highly Integrated XENSIV™ 60 GHz CMOS Radar

[Munich, Germany, November 3, 2025] Infineon Technologies AG, a global semiconductor leader in power systems and the Internet of Things, has recently introduced the XENSIV™ BGT60CUTR13AIP—a new generation of highly integrated 60 GHz CMOS radar sensors. Designed for ultra-low-power IoT solutions, this sensor will serve as a key physical AI sensor enhancing the intelligence of smart home and IoT devices. Paired with Infineon's comprehensive support for software, hardware, third-party modules, and ....
2025-11-03 13:51:00 924
Infineon Launches New Generation of Highly Integrated XENSIV™ 60 GHz CMOS Radar

Teledyne e2v Completes Initial Qualification of 16GB Space-Grade DDR4 Memory

Grenoble, France – Teledyne e2v Semiconductors is pleased to announce the successful initial qualification of its 16GB space-grade DDR4 memory, marking a key milestone in the development of high-reliability space-grade storage solutions. Figure. 1 Both this 16GB DDR4 memory and the 8GB DDR4 validated last year are part of Teledyne e2v's expanding radiation-hardened memory portfolio. The 16GB version doubles capacity while maintaining identical dimensions and pin compatibility, enabling seamless integ....
2025-10-31 14:43:02 1257
Teledyne e2v Completes Initial Qualification of 16GB Space-Grade DDR4 Memory

Infineon Launches First High-Density Trans-Inductive Voltage Regulator (TLVR) Power Module Optimized for AI Data Centers

[Munich, Germany, October 28, 2025] With the rapid growth of cloud services, particularly those related to artificial intelligence (AI), data centers now account for over 2% of global energy consumption. This figure is projected to climb further, achieving an exponential 165% increase between 2023 and 2030. Consequently, continuously improving efficiency, power density, and signal integrity throughout the power conversion process—from the grid to the core—is critical for enhancing computational ....
2025-10-28 16:34:15 1575
Infineon Launches First High-Density Trans-Inductive Voltage Regulator (TLVR) Power Module Optimized for AI Data Centers

Ceva Launches Wi-Fi 7 1x1 Client IP to Power Smarter, Faster AIoT and Physical AI Devices

Ceva's Wi-Fi 7 1x1 client IP enables smarter, more responsive AIoT devices and emerging physical AI systemsNow available and adopted by multiple customers, Ceva-Waves Wi-Fi® 7 1x1 client IP delivers ultra-high performance and low-latency connectivity to enable edge intelligence in wearables, smart home devices, and industrial IoT. Figure. 1 As IoT devices demand faster, more reliable, and smarter connectivity, Wi-Fi® 7 emerges as the key enabler for real-time edge performance and next-generation us....
2025-10-23 17:57:19 994
Ceva Launches Wi-Fi 7 1x1 Client IP to Power Smarter, Faster AIoT and Physical AI Devices

Arm Attends OPPO Developer Conference, Explores New Trends in Edge AI Technology and Applications

On October 15, the OPPO ColorOS 16 launch event and OPPO Developer Conference were grandly held in Shenzhen. Beyond unveiling OPPO's latest technologies, the conference featured multiple forums where industry leaders discussed technological innovation and building new AI ecosystems. At the event, Arm delivered a keynote address, sharing insights on the evolution of edge AI and how Arm's latest Lumex AI computing platform drives technological breakthroughs, application innovation, and ecosystem collaboration....
2025-10-20 17:12:29 1519
Arm Attends OPPO Developer Conference, Explores New Trends in Edge AI Technology and Applications

Teradyne Launches Titan HP: Breakthrough System-Level Test Solution Empowering Cloud Infrastructure and AI Chip Development

BEIJING, China, October 15, 2025 — Teradyne, a global leader in automated test solutions and advanced robotics, today announced the launch of the Titan HP System-Level Test (SLT) platform, specifically designed for the cloud infrastructure and artificial intelligence (AI) markets. This innovative solution emerges in response to growing market demand for advanced technologies driven by continuous process node scaling and the emergence of new architectures.As complex chips used in AI and cloud infrastru....
2025-10-15 15:11:44 1529
Teradyne Launches Titan HP: Breakthrough System-Level Test Solution Empowering Cloud Infrastructure and AI Chip Development

Rockwell Automation Unveils ControlLogix 5590 Controller, Pioneering a New Era in Industrial Control

(October 11, 2025, Shanghai, China) – As a global leader in industrial automation, information, and digital transformation, Rockwell Automation today announced the highly anticipated launch of its latest controller, the ControlLogix® 5590. Serving as the core engine of the Logix platform, this versatile controller is designed to meet the evolving demands of modern manufacturing. It enables seamless software integration and enterprise-level multi-domain control, significantly streamlining operation....
2025-10-11 15:57:31 756
Rockwell Automation Unveils ControlLogix 5590 Controller, Pioneering a New Era in Industrial Control

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