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Home / News

WPG HOLDINGS Launches Automotive General Evaluation Board Solution Based on NXP Products

January 2, 2025 - WPG HOLDINGS, a leading international semiconductor component distributor dedicated to the Asia-Pacific market, announced that its subsidiary, World Peace, has launched an automotive universal evaluation board solution based on NXP's S32K312 microcontrollers and FS2303B secure power management chips. Figure 1 - WPG HOLDINGS automotive universal evaluation board solution based on NXP products As the global automotive industry moves into a new phase of intelligence, automakers are not only ....
2025-01-03 10:39:55 1353
WPG HOLDINGS Launches Automotive General Evaluation Board Solution Based on NXP Products

MediaTek Unveils Dimensity 8400: A High-Performance 5G AI Chip for Next-Gen Smart Devices

With the rapid development of 5G technology in recent years, the performance needs of smartphones and other smart devices are increasing. As a leading global semiconductor company, MediaTek has been committed to advancing the development of mobile communications technology, and recently released its latest Tenguet 8400 5G all-big-core smart body AI chip. It is reported that this chip not only achieves a major breakthrough in performance and energy efficiency, but also excels in AI processing and network con....
2024-12-27 10:34:02 807
MediaTek Unveils Dimensity 8400: A High-Performance 5G AI Chip for Next-Gen Smart Devices

MediaTek Launches Tenguet 8400 Mobile Chip, Ushering in the Era of All-Big-Core Computing in High-End Smartphones

December 23, 2024 - MediaTek announced the Tenguet 8400 5G All-Big-Core Intelligent Body AI chip. Tenguet 8400 inherits many of the advanced technologies of Tenguet's flagship chipset, and is the first to empower the high-end smartphone market with an innovative all-big-core architectural design, and delivers superior generative AI performance to provide a smart-body AI experience for high-end smartphones. Dr. Robin Lee, General Manager of MediaTek's Wireless Communications Business Unit, said, “With ....
2024-12-24 09:44:32 1203
MediaTek Launches Tenguet 8400 Mobile Chip, Ushering in the Era of All-Big-Core Computing in High-End Smartphones

Infineon Partners with Everest Lithium to Create Next-Generation Battery Management System

Munich, Germany, December 18, [2024] - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), the global semiconductor leader in power systems and the Internet of Things (IoT), has signed a Memorandum of Understanding (MoU) with lithium battery manufacturer Everest Lithium-Integrated Corp. The two companies will work together to provide integrated battery management system solutions for the automotive market. According to the MoU, Infineon will provide a complete set of silicon solutions, including microcontro....
2024-12-19 09:53:31 1306
Infineon Partners with Everest Lithium to Create Next-Generation Battery Management System

Qorvo Receives GSA's 2024 “Most Admired Semiconductor Public Company” Award

BEIJING, China, December 17, 2024 - Qorvo (NASDAQ: QRVO), a leading global provider of connectivity and power solutions, today announced that it has once again been honored with the 2024 Most Admired Semiconductor Public Company award from the Global Semiconductor Alliance (GSA). Listed Company” award from the Global Semiconductor Alliance (GSA) for 2024. This is the second time Qorvo has been honored in this category after 2022. Figure. 1 Each year at the awards dinner, GSA recognizes semiconductor ....
2024-12-18 10:24:56 1610
Qorvo Receives GSA's 2024 “Most Admired Semiconductor Public Company” Award

IBM unveils key breakthrough in optics, ushering in the “speed of light era” for generative AI

New optoelectronic co-packaging technology may replace electrical interconnects in data centers, dramatically increasing the speed and energy efficiency of AI and other computing applications BEIJING, Dec. 12, 2024 /PRNewswire/ -- IBM (NYSE: IBM) recently unveiled its breakthrough research in optics technology that promises to dramatically improve the efficiency of training and running generative AI models in data centers.The next-generation photovoltaic co-packaged optics (CPO) process, developed by IBM re....
2024-12-13 11:00:52 1637
IBM unveils key breakthrough in optics, ushering in the “speed of light era” for generative AI

Vishay introduced advanced performance of the new 40 V MOSFETs

MALVERN, Pennsylvania, USA and SHANGHAI, China - December 4, 2024 - Vishay Intertechnology, Inc. (NYSE: VSH) has announced the introduction of a new 40 V TrenchFET Quad n-channel power MOSFET, the SiJK140E, in the PowerPAK 10x12 package. TrenchFET four-generation n-channel power MOSFET --- SiJK140E, the device has excellent on-resistance, can provide higher efficiency and power density for industrial applications. The Vishay Siliconix SiJK140E offers 32 percent lower on-resistance than competing devices wit....
2024-12-05 10:59:11 769
Vishay introduced advanced performance of the new 40 V MOSFETs

Emmaus OSRAM and Fraunhofer research team honored with “German Future Award” for “Digital Light” project

Emmaus OSRAM and the Fraunhofer research team have been honored with the “German Future Award”. The award, which is presented by the President of Germany, recognizes outstanding innovations in the field of science and technology and is one of Germany's most prestigious prizes for scientific achievement; Emmaus OSRAM's “Digital Light” LED technology is leading the way in intelligent and highly precise transportation lighting, enabling new and safe applications such as projection. SHAN....
2024-12-02 10:25:58 1537
Emmaus OSRAM and Fraunhofer research team honored with “German Future Award” for “Digital Light” project

NXP unveils first ultra-wideband wireless battery management system solution

NXP's ultra-wideband (UWB) wireless battery management system (BMS) simplifies electric vehicle assembly, improves battery energy density and separates mechanical and electrical development for faster time-to-market Trimension UWB resists reflections and frequency-selective fading within the battery pack more effectively than existing narrowband technologies, ensuring more stable and reliable data transmission The solution is part of NXP's FlexCom chipset, which supports both wired and wireless BMS configur....
2024-11-27 09:51:48 1354
NXP unveils first ultra-wideband wireless battery management system solution

Renesas First to Launch Second Generation DDR5 MRDIMM Complete Memory Interface Chipset Solution for Servers

BEIJING, China, Nov. 20, 2024 - Renesas Electronics Corporation (TSE: 6723), a global provider of semiconductor solutions, today announced the first complete memory interface chipset solution for second-generation DDR5 multi-capacity dual-row in-line memory modules (MRDIMMs). Figure. 1 Artificial intelligence (AI), high-performance computing (HPC) and other data center applications have increasing memory bandwidth requirements, necessitating the new DDR5 MRDIMMs, which operate at speeds of up to 12,800 meg....
2024-11-22 10:00:57 1693
Renesas First to Launch Second Generation DDR5 MRDIMM Complete Memory Interface Chipset Solution for Servers

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