BEIJING, China, Nov. 20, 2024 - Renesas Electronics Corporation (TSE: 6723), a global provider of semiconductor solutions, today announced the first complete memory interface chipset solution for second-generation DDR5 multi-capacity dual-row in-line memory modules (MRDIMMs).

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Artificial intelligence (AI), high-performance computing (HPC) and other data center applications have increasing memory bandwidth requirements, necessitating the new DDR5 MRDIMMs, which operate at speeds of up to 12,800 megabyte transfers per second (MT/s); a 1.35x increase in memory bandwidth compared to first-generation solutions. Renesas played a key role in the design, development and deployment of the new MRDIMMs in collaboration with industry leaders, including CPU and memory suppliers, as well as end customers.

Renesas designed and launched three new key components: the RRG50120 second-generation multiplexed register clock driver (MRCD), the RRG51020 second-generation multiplexed data buffer (MDB), and the RRG53220 second-generation power management integrated circuit (PMIC). In addition, Renesas mass-produces Temperature Sensor (TS) and Serial Presence Detection (SPD) hub solutions, and offers comprehensive chipset solutions for all types of server and client DIMMs, including industry-standard next-generation MRDIMMs. As a preeminent player in the memory interface space, Renesas is committed to providing customers with high-quality, high-performance products and services.

The demand for higher performance systems for AI and HPC applications continues to grow,” said Davin Lee, Senior Vice President and General Manager of Analog & Connectivity and Embedded Processing. Renesas is following this trend by working with industry leaders to develop next-generation technologies and specifications. These companies rely on Renesas' technical expertise and manufacturing capabilities to meet the growing demand. Our latest chipset solutions for second-generation DDR5 MRDIMMs reflect Renesas' preeminent position in this market segment.”

The Renesas RRG50120 second-generation MRCD is used in MRDIMMs to buffer the command/address (CA) bus, chip select and clock between the host controller and DRAM. It consumes 45 percent less power than the first generation. This is a key metric for thermal management in ultra-high-speed systems.The RRG51020 Gen 2 MDB is another key device used in MRDIMMs to buffer data from the host CPU to the DRAM. Both Renesas' new MRCD and MDB support speeds up to 12.8 gigabits per second (Gbps). In addition, Renesas' RRG53220 next-generation PMIC offers excellent electrical overvoltage protection and superior power efficiency, and is optimized for high-current and low-voltage operation.