EP3C16F484C8N Intel FPGAs: Features, Applications and Datasheet

2025-07-02 10:00:42 680

EP3C16F484C8N Description

The EP3C16F484C8N is a mid-density FPGA from Intel’s Cyclone III family, offering 15,408 logic elements, optimized for low power and cost-sensitive applications. Packaged in a 484-pin FBGA, it supports a wide range of I/O standards and is suitable for embedded, control, and signal-processing systems.

 

EP3C16F484C8N Features

15,408 logic elements (LEs)

504 Kbits of embedded SRAM

56 embedded 18x18 multipliers for DSP functions

Up to 331 user I/O pins

Four integrated PLLs for flexible clock generation

Supports Passive Serial, Active Serial, and JTAG configuration modes

1.2V core voltage; supports multiple I/O voltages (1.8V, 2.5V, 3.3V)

Low static and dynamic power consumption

Compatible with various I/O standards, including LVDS, SSTL, HSTL

 

EP3C16F484C8N Applications

Industrial automation controllers

Embedded image and video processing systems

Communication interface bridging (e.g., SPI to UART)

Renewable energy system controllers

Medical device logic control

Educational FPGA platforms

I/O expansion boards and custom SoC prototypes

 

EP3C16F484C8N CAD Model

Symbol

Footprint

3D Model

 

EP3C16F484C8N Alternatives

EP3C25F484C8N: Same package with higher logic capacity (24,624 LEs)

EP3C10F484C8N: Same package with fewer resources (10,320 LEs)

EP4CE15F23C8N: Cyclone IV E successor with better power efficiency

EP3C16F256C8N: Same logic size in smaller 256-pin package

EP2C20F484C8N: Older Cyclone II FPGA, same package, fewer features

 

EP3C16F484C8N Manufacturer

Intel Corporation is a global leader in semiconductor innovation, best known for designing and manufacturing advanced microprocessors and related technologies that power the majority of the world’s computers and connected devices. Founded in 1968 and headquartered in Santa Clara, California, Intel pioneered the x86 architecture, which has become the foundation of most modern personal computers.

Over the decades, Intel has expanded its portfolio beyond CPUs to include FPGAs, system-on-chip (SoC) solutions, graphics processing units (GPUs), networking hardware, AI accelerators, and memory technologies. The company serves diverse industries such as cloud computing, artificial intelligence, autonomous driving, communications, and edge computing.

With a strong focus on innovation, Intel continues to drive technological advancement through cutting-edge manufacturing processes, including its transition to Intel 7, Intel 4, and future nodes. As a trusted technology provider, Intel plays a key role in shaping the future of computing and digital transformation globally.

 

EP3C16F484C8N FAQs

What kind of clock sources can be used with EP3C16F484C8N?

The device can accept external clock inputs through dedicated global clock pins and can generate derived clocks using its internal PLLs.

 

How is power distributed internally within the EP3C16F484C8N?

The FPGA uses separate power rails for the core (1.2V), I/O banks (1.8V/2.5V/3.3V), and auxiliary circuits, enabling flexible system-level power design.

 

Is partial reconfiguration supported on this device?

No, Cyclone III FPGAs do not support partial reconfiguration; the entire configuration memory must be updated as a whole during reprogramming.

 

Can EP3C16F484C8N interface directly with external flash memory?

Yes, it can interface with serial flash memory (such as EPCS devices) for Active Serial configuration and can also communicate with parallel flash via user logic.

 

What are the static power characteristics of the EP3C16F484C8N?

Thanks to its 65nm low-power process, the device consumes less than 0.5W in most standby or low-activity use cases, depending on configuration and I/O activity.

Tags:

Share

Related News more>

Infineon Launches New Generation of Highly Integrated XENSIV™ 60 GHz CMOS Radar
[Munich, Germany, November 3, 2025] Infineon Technologies AG, a global semiconductor leader in power systems and the Internet of Things, has recently introduced the XENSIV™ BGT60CUTR13AIP—a new generation of highly integrated 60 GHz CMOS radar sensors. Designed for ultra-low-power IoT solutions, this sensor will serve as a key physical AI sensor enhancing the intelligence of smart home and IoT devices. Paired with Infineon's comprehensive support for software, hardware, third-party modules, and ....
EN6337QI DC-DC-Converters: Features, Applications and Datasheet
EN6337QI Description The EN6337QI is a synchronous buck DC-DC converter power module that delivers up to 6A continuous output current. It integrates the controller, MOSFETs, inductor, and passive components into a single compact package, minimizing external design complexity. Designed for high-efficiency point-of-load (POL) power conversion, it provides a fast transient response and tight voltage regulation, ideal for powering FPGAs, ASICs, and processors. EN6337QI Features Wide Input Voltage Range: 2.4V ....
Teledyne e2v Completes Initial Qualification of 16GB Space-Grade DDR4 Memory
Grenoble, France – Teledyne e2v Semiconductors is pleased to announce the successful initial qualification of its 16GB space-grade DDR4 memory, marking a key milestone in the development of high-reliability space-grade storage solutions. Figure. 1 Both this 16GB DDR4 memory and the 8GB DDR4 validated last year are part of Teledyne e2v's expanding radiation-hardened memory portfolio. The 16GB version doubles capacity while maintaining identical dimensions and pin compatibility, enabling seamless integ....
Applications of Photodetectors in Display Spectral Analysis: Multi-Channel Data Acquisition and Processing
As display technology evolves toward higher resolution and wider color gamuts, spectral analysis has become a core tool for evaluating display performance and optimizing color reproduction. As the “sensory nerves” of spectral analysis systems, photodetectors' multi-channel data acquisition and processing capabilities directly impact analytical precision and efficiency. Through multi-channel array configurations and intelligent algorithm integration, photodetectors are reshaping the technical par....