HSS28-B20-P39

CUI Devices

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HSS28-B20-P39

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HEAT SINK, STAMPING, TO-218/TO-2

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Update Time: 2023-12-11 10:24:48

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Mfr	CUI Devices
Type	Board Level
Shape	Square, Fins
Width	0.748" (19.00mm)
Length	0.748" (19.00mm)
Series	HSS
Package	Bag
Diameter	-
Material	Aluminum Alloy
Fin Height	0.374" (9.50mm)
Package Cooled	TO-218, TO-220
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Bolt On and PC Pin
Thermal Resistance @ Natural	27.66°C/W
Power Dissipation @ Temperature Rise	2.71W @ 75°C
Thermal Resistance @ Forced Air Flow	12.00°C/W @ 200 LFM