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HSB16-404018
CUI Devices
Product No:
HSB16-404018
Manufacturer:
Package:
-
Manufacturer Standard Lead Time:
9 Weeks
Datasheet:
Description:
HEAT SINK, BGA, 40 X 40 X 18 MM
Quantity:
Delivery:
Payment:
In Stock : Please Inquiry 
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
$2.1185
$2.1185
10
$2.06245
$20.6245
25
$2.00678
$50.1695
50
$1.89544
$94.772
100
$1.78391
$178.391
250
$1.672418
$418.1045
500
$1.616653
$808.3265
1000
$1.449424
$1449.424
5000
$1.421552
$7107.76
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Product Information
Parameter Info
Product Details
User Guide
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 1.575" (40.00mm) |
| Length | 1.575" (40.00mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.709" (18.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 7.96°C/W |
| Power Dissipation @ Temperature Rise | 9.4W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 2.60°C/W @ 200 LFM |
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