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HSB27-434316
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HSB27-434316

CUI Devices

Product No:

HSB27-434316

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

pdf

Description:

HEAT SINK, BGA, 43.1 X 43.1 X 16

Quantity:

Delivery:

1.webp 4.webp 5.webp 2.webp 3.webp

Payment:

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In Stock : Please Inquiry

Update Time: 2024-07-19 17:47:33

Minimum: 1 Multiples: 1

Qty

Unit Price

Ext Price

  • 1

    $2.47

    $2.47

  • 10

    $2.3902

    $23.902

  • 25

    $2.32104

    $58.026

  • 50

    $2.1831

    $109.155

  • 100

    $1.96194

    $196.194

  • 250

    $1.934352

    $483.588

  • 500

    $1.809997

    $904.9985

  • 1000

    $1.782371

    $1782.371

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Product Information

Parameter Info

Product Details

User Guide

Mfr CUI Devices
Type Top Mount
Shape Square, Pin Fins
Width 1.697" (43.10mm)
Length 1.697" (43.10mm)
Series HSB
Package Box
Diameter -
Material Aluminum Alloy
Fin Height 0.650" (16.51mm)
Package Cooled BGA
Product Status Active
Material Finish Black Anodized
Attachment Method Adhesive
Thermal Resistance @ Natural 8.35°C/W
Power Dissipation @ Temperature Rise 8.98W @ 75°C
Thermal Resistance @ Forced Air Flow 2.80°C/W @ 200 LFM