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HSB23-232325
CUI Devices
Product No:
HSB23-232325
Manufacturer:
Package:
-
Manufacturer Standard Lead Time:
10 Weeks
Datasheet:
Description:
HEAT SINK, BGA, 23 X 23 X 25 MM
Quantity:
Delivery:
Payment:
In Stock : Please Inquiry 
Update Time: 2024-07-19 17:47:33
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
$1.3015
$1.3015
10
$1.2616
$12.616
25
$1.22512
$30.628
50
$1.15216
$57.608
100
$1.0355
$103.55
250
$1.020908
$255.227
500
$0.955282
$477.641
1000
$0.94069
$940.69
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Product Information
Parameter Info
Product Details
User Guide
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 0.906" (23.00mm) |
| Length | 0.906" (23.00mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.984" (25.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 12.23°C/W |
| Power Dissipation @ Temperature Rise | 6.13W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 3.80°C/W @ 200 LFM |
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