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HSB10-232306
CUI Devices
Product No:
HSB10-232306
Manufacturer:
Package:
-
Manufacturer Standard Lead Time:
10 Weeks
Datasheet:
Description:
HEAT SINK, BGA, 23 X 23 X 6 MM
Quantity:
Delivery:
Payment:
In Stock : Please Inquiry 
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
$0.798
$0.798
10
$0.7562
$7.562
25
$0.7182
$17.955
50
$0.69939
$34.9695
100
$0.68989
$68.989
250
$0.642656
$160.664
500
$0.604865
$302.4325
1000
$0.54816
$548.16
5000
$0.529264
$2646.32
Not the price you want? Send RFQ Now and we'll contact you ASAP.
Product Information
Parameter Info
Product Details
User Guide
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 0.906" (23.00mm) |
| Length | 0.906" (23.00mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.236" (6.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 25.46°C/W |
| Power Dissipation @ Temperature Rise | 3.0W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 9.60°C/W @ 200 LFM |
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