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HSB06-181810
CUI Devices
Product No:
HSB06-181810
Manufacturer:
Package:
-
Manufacturer Standard Lead Time:
10 Weeks
Datasheet:
Description:
HEAT SINK, BGA, 18 X 18 X 10 MM
Quantity:
Delivery:
Payment:
In Stock : Please Inquiry 
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
$0.969
$0.969
10
$0.91675
$9.1675
25
$0.893
$22.325
50
$0.86868
$43.434
100
$0.820515
$82.0515
250
$0.772198
$193.0495
500
$0.723938
$361.969
1000
$0.675678
$675.678
5000
$0.651548
$3257.74
Not the price you want? Send RFQ Now and we'll contact you ASAP.
Product Information
Parameter Info
Product Details
User Guide
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 0.709" (18.00mm) |
| Length | 0.709" (18.00mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.394" (10.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 23.68°C/W |
| Power Dissipation @ Temperature Rise | 3.2W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 18.80°C/W @ 200 LFM |
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