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HSB05-171711
CUI Devices
Product No:
HSB05-171711
Manufacturer:
Package:
-
Manufacturer Standard Lead Time:
10 Weeks
Datasheet:
Description:
HEAT SINK, BGA, 17 X 17 X 11.5 M
Quantity:
Delivery:
Payment:
In Stock : Please Inquiry 
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
$1.026
$1.026
10
$0.97565
$9.7565
25
$0.94962
$23.7405
50
$0.92397
$46.1985
100
$0.87267
$87.267
250
$0.821332
$205.333
500
$0.769994
$384.997
1000
$0.718666
$718.666
5000
$0.692996
$3464.98
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Product Information
Parameter Info
Product Details
User Guide
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 0.669" (17.00mm) |
| Length | 0.669" (17.00mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.453" (11.50mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive |
| Thermal Resistance @ Natural | 23.91°C/W |
| Power Dissipation @ Temperature Rise | 3.1W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 8.40°C/W @ 200 LFM |
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