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HSB01-080808
CUI Devices
Product No:
HSB01-080808
Manufacturer:
Package:
-
Manufacturer Standard Lead Time:
10 Weeks
Datasheet:
Description:
HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
Quantity:
Delivery:
Payment:
In Stock : Please Inquiry 
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
$0.6935
$0.6935
10
$0.66405
$6.6405
25
$0.6308
$15.77
50
$0.61427
$30.7135
100
$0.60591
$60.591
250
$0.564376
$141.094
500
$0.531183
$265.5915
1000
$0.481384
$481.384
5000
$0.464778
$2323.89
Not the price you want? Send RFQ Now and we'll contact you ASAP.
Product Information
Parameter Info
Product Details
User Guide
| Mfr | CUI Devices |
| Type | Top Mount |
| Shape | Square, Pin Fins |
| Width | 0.335" (8.50mm) |
| Length | 0.335" (8.50mm) |
| Series | HSB |
| Package | Box |
| Diameter | - |
| Material | Aluminum Alloy |
| Fin Height | 0.315" (8.00mm) |
| Package Cooled | BGA |
| Product Status | Active |
| Material Finish | Black Anodized |
| Attachment Method | Adhesive (Not Included) |
| Thermal Resistance @ Natural | 39.10°C/W |
| Power Dissipation @ Temperature Rise | 1.9W @ 75°C |
| Thermal Resistance @ Forced Air Flow | 16.00°C/W @ 200 LFM |
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