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Home / News

SMARTSENS Launches 5 MP Automotive Grade CMOS Image Sensor SC530AT

Shanghai, China, February 6, 2025 - SMARTSENS (Shanghai) Electronics Technology Co., Ltd (SMARTSENS, Stock Code: 688213) recently announced the launch of its 5MP automotive-grade image sensor, the SC530AT. as the newest addition to its Automotive Sensor(AT) Series, the SC530AT is based on the CarSens?-R-R series. As a new product of Stellar Technology's Automotive Sensor (AT) Series, the SC530AT is based on the CarSens?-RS process technology and combines the performance advantages of high sensitivity, high ....
2025-02-08 11:06:53 1008
SMARTSENS Launches 5 MP Automotive Grade CMOS Image Sensor SC530AT

Infineon Introduces PSOC™ Control MCUs to Improve Performance and Efficiency of Motor Control and Power Conversion Systems

MUNICH, GERMANY, January 22, 2025 - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), the global semiconductor leader in power systems and the Internet of Things, introduces PSOC™ Control, the latest family of high-performance microcontrollers (MCUs) based on the Arm® Cortex®-M33. in Supported by ModusToolbox™ system design tools and software, this comprehensive solution enables developers to easily create high-performance, efficient and safe motor control and power conversion systems.....
2025-01-24 11:02:38 1056
Infineon Introduces PSOC™ Control MCUs to Improve Performance and Efficiency of Motor Control and Power Conversion Systems

Infineon Introduces New MOTIX™ Full-Bridge IC Family for Intelligent Brushed DC Motor Applications, Enabling Comfortable and Convenient Driving Experiences

Munich, Germany, January 20, 2025 - As the automotive industry continues to evolve, once high-end features are now standard. As a result, intelligent low-voltage motors will play an increasingly important role in shaping the future automotive user experience. Automakers are looking for semiconductor solutions that are more reliable, energy-efficient and cost-effective, while also operating under harsh conditions. To meet this demand, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) introduces the MOTIX&tr....
2025-01-21 10:05:57 807
Infineon Introduces New MOTIX™ Full-Bridge IC Family for Intelligent Brushed DC Motor Applications, Enabling Comfortable and Convenient Driving Experiences

Mouser Now Offering Molex MX150 Cylinder Thru Seal Connectors for Next Generation Automotive and Industrial Applications

January 15, 2025 - Mouser Electronics, a global authorized distributor of electronic components and industrial automation products with a focus on new product introductions, is pleased to announce the availability of Molex's MX150 cylinder-sealed feedthrough connectors. This connector is part of Molex's rugged and reliable MX150 automotive connector series, which meets the industry's growing demand for high-reliability motors for next-generation automotive and industrial applications. This cost-effective so....
2025-01-16 09:38:36 793
Mouser Now Offering Molex MX150 Cylinder Thru Seal Connectors for Next Generation Automotive and Industrial Applications

Foxconn expanding iPhone production capacity in India is blocked: recall mainland workers, equipment is detained!

January 12 news, according to “Rest of the world” reports, according to five people familiar with Foxconn India business, Hon Hai's Foxconn will stop sending mainland Chinese workers and equipment to the Apple iPhone factory in India, has been stationed in India, mainland Chinese workers were also recalled, and the original shipment of special equipment for India was detained in China. Manufacturing equipment is detained in China.Foxconn's Expansion of iPhone Production Capacity in India Blocked....
2025-01-13 14:59:51 719
Foxconn expanding iPhone production capacity in India is blocked: recall mainland workers, equipment is detained!

Gatland Integrates Cadence Tensilica ConnX 220 DSP to Comprehensively Upgrade Automotive Imaging Radar Solutions

SHANGHAI, China, Jan. 7, 2025 -- Cadence Electronics (Cadence Inc., NASDAQ: CDNS) and Gatland, a leader in the development and design of millimeter-wave radar chips, today announced that Cadence has licensed Gatland to integrate the Cadence Tensilica ConnX 220 DSP into its advanced radar solutions. The collaboration is designed to improve the performance and efficiency of automotive imaging radar systems and to fuel innovation in the rapidly evolving automotive industry. Figure. 1 The integration of the Co....
2025-01-08 09:48:24 644
Gatland Integrates Cadence Tensilica ConnX 220 DSP to Comprehensively Upgrade Automotive Imaging Radar Solutions

WPG HOLDINGS Launches Automotive General Evaluation Board Solution Based on NXP Products

January 2, 2025 - WPG HOLDINGS, a leading international semiconductor component distributor dedicated to the Asia-Pacific market, announced that its subsidiary, World Peace, has launched an automotive universal evaluation board solution based on NXP's S32K312 microcontrollers and FS2303B secure power management chips. Figure 1 - WPG HOLDINGS automotive universal evaluation board solution based on NXP products As the global automotive industry moves into a new phase of intelligence, automakers are not only ....
2025-01-03 10:39:55 1260
WPG HOLDINGS Launches Automotive General Evaluation Board Solution Based on NXP Products

MediaTek Unveils Dimensity 8400: A High-Performance 5G AI Chip for Next-Gen Smart Devices

With the rapid development of 5G technology in recent years, the performance needs of smartphones and other smart devices are increasing. As a leading global semiconductor company, MediaTek has been committed to advancing the development of mobile communications technology, and recently released its latest Tenguet 8400 5G all-big-core smart body AI chip. It is reported that this chip not only achieves a major breakthrough in performance and energy efficiency, but also excels in AI processing and network con....
2024-12-27 10:34:02 676
MediaTek Unveils Dimensity 8400: A High-Performance 5G AI Chip for Next-Gen Smart Devices

MediaTek Launches Tenguet 8400 Mobile Chip, Ushering in the Era of All-Big-Core Computing in High-End Smartphones

December 23, 2024 - MediaTek announced the Tenguet 8400 5G All-Big-Core Intelligent Body AI chip. Tenguet 8400 inherits many of the advanced technologies of Tenguet's flagship chipset, and is the first to empower the high-end smartphone market with an innovative all-big-core architectural design, and delivers superior generative AI performance to provide a smart-body AI experience for high-end smartphones. Dr. Robin Lee, General Manager of MediaTek's Wireless Communications Business Unit, said, “With ....
2024-12-24 09:44:32 1128
MediaTek Launches Tenguet 8400 Mobile Chip, Ushering in the Era of All-Big-Core Computing in High-End Smartphones

Infineon Partners with Everest Lithium to Create Next-Generation Battery Management System

Munich, Germany, December 18, [2024] - Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), the global semiconductor leader in power systems and the Internet of Things (IoT), has signed a Memorandum of Understanding (MoU) with lithium battery manufacturer Everest Lithium-Integrated Corp. The two companies will work together to provide integrated battery management system solutions for the automotive market. According to the MoU, Infineon will provide a complete set of silicon solutions, including microcontro....
2024-12-19 09:53:31 1189
Infineon Partners with Everest Lithium to Create Next-Generation Battery Management System

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