EP3C5E144C8N FPGAs: Features, Applications and Datasheet

2025-07-07 10:35:13 474

EP3C5E144C8N Description

The EP3C5E144C8N is part of the Cyclone® III FPGA family from Intel (formerly Altera), designed for low power and high-volume applications. Packaged in a 144-pin EQFP form factor, this device offers 5,136 logic elements and is fabricated using a 65 nm low-power process. It strikes a balance between performance and cost-efficiency, making it ideal for a wide range of embedded and control-oriented designs.

 

EP3C5E144C8N Features

Logic Elements (LEs): 5,136 for implementing custom logic designs

Embedded Memory: 423 Kbits of RAM for data buffering and storage

PLL Support: 2 PLLs for high-precision clock generation and management

I/O Pins: 83 programmable I/O pins for versatile peripheral interfacing

Power Efficiency: Optimized for low static and dynamic power consumption

Package Type: 144-pin EQFP, suitable for compact PCB designs

Operating Temperature: Commercial grade (0°C to +85°C)

 

EP3C5E144C8N Applications

Consumer Electronics: Used in devices like digital cameras, gaming consoles, and home appliances

Industrial Control: Ideal for PLCs, automation controllers, and smart sensors

Communications: Suitable for network protocol bridging, low-speed serial communication

Medical Devices: Employed in cost-sensitive portable diagnostic equipment

Educational Tools: Common in university-level FPGA development kits and projects

 

EP3C5E144C8N CAD Model

Symbol

Footprint

3D Model

 

EP3C5E144C8N Alternatives

Here are a few alternatives with similar logic capacity or footprint:

EP3C5F256C8N: Same logic capacity with a different 256-pin FBGA package

EP4CE6E22C8N: Higher-performance Cyclone IV device with 6,272 logic elements

LFE5U-12F-6MG285C (Lattice ECP5): A comparable low-power FPGA from Lattice

XC6SLX9-2TQG144C (Xilinx Spartan-6): Close logic density and pin-count from Xilinx

 

EP3C5E144C8N Manufacturer

Intel Corporation is a global technology leader known for designing and manufacturing innovative semiconductor products, including microprocessors, chipsets, and integrated circuits. Founded in 1968 and headquartered in Santa Clara, California, Intel pioneered the x86 architecture and remains one of the world’s largest and most influential chipmakers. Its processors power a vast range of computing devices—from personal computers and servers to embedded systems and IoT platforms. In addition to CPUs, Intel also offers solutions in AI, networking, graphics, and memory technologies. With a strong focus on research, sustainability, and manufacturing excellence, Intel continues to shape the future of computing worldwide.

 

EP3C5E144C8N FAQs

1. Does EP3C5E144C8N support in-system programming (ISP)?

Yes, it supports ISP via the JTAG interface, allowing users to update the configuration memory without removing the chip from the board.

 

2. What is the typical power consumption profile for this device?

Under normal operating conditions, the EP3C5E144C8N consumes around 85–150 mW, making it suitable for battery-powered systems and thermally constrained environments.

 

3. Can this FPGA interface directly with 3.3V logic levels?

Yes, the I/O banks support various voltage standards including 3.3V LVCMOS, making it compatible with common microcontroller and peripheral logic levels.

 

4. Is the EP3C5E144C8N suitable for high-speed serial communication?

This specific model lacks integrated SERDES blocks, so while it supports basic serial protocols like UART, SPI, and I²C, it is not ideal for high-speed transceiver applications.

 

5. What is the configuration file format used for programming this FPGA?

The device uses a .sof (SRAM Object File) for configuration during development and a .pof (Programming Object File) for programming non-volatile configuration devices like EPCS serial flash.

Tags:

Share

Related News more>

Infineon Launches New Generation of Highly Integrated XENSIV™ 60 GHz CMOS Radar
[Munich, Germany, November 3, 2025] Infineon Technologies AG, a global semiconductor leader in power systems and the Internet of Things, has recently introduced the XENSIV™ BGT60CUTR13AIP—a new generation of highly integrated 60 GHz CMOS radar sensors. Designed for ultra-low-power IoT solutions, this sensor will serve as a key physical AI sensor enhancing the intelligence of smart home and IoT devices. Paired with Infineon's comprehensive support for software, hardware, third-party modules, and ....
EN6337QI DC-DC-Converters: Features, Applications and Datasheet
EN6337QI Description The EN6337QI is a synchronous buck DC-DC converter power module that delivers up to 6A continuous output current. It integrates the controller, MOSFETs, inductor, and passive components into a single compact package, minimizing external design complexity. Designed for high-efficiency point-of-load (POL) power conversion, it provides a fast transient response and tight voltage regulation, ideal for powering FPGAs, ASICs, and processors. EN6337QI Features Wide Input Voltage Range: 2.4V ....
Teledyne e2v Completes Initial Qualification of 16GB Space-Grade DDR4 Memory
Grenoble, France – Teledyne e2v Semiconductors is pleased to announce the successful initial qualification of its 16GB space-grade DDR4 memory, marking a key milestone in the development of high-reliability space-grade storage solutions. Figure. 1 Both this 16GB DDR4 memory and the 8GB DDR4 validated last year are part of Teledyne e2v's expanding radiation-hardened memory portfolio. The 16GB version doubles capacity while maintaining identical dimensions and pin compatibility, enabling seamless integ....
Applications of Photodetectors in Display Spectral Analysis: Multi-Channel Data Acquisition and Processing
As display technology evolves toward higher resolution and wider color gamuts, spectral analysis has become a core tool for evaluating display performance and optimizing color reproduction. As the “sensory nerves” of spectral analysis systems, photodetectors' multi-channel data acquisition and processing capabilities directly impact analytical precision and efficiency. Through multi-channel array configurations and intelligent algorithm integration, photodetectors are reshaping the technical par....