EN2340QI Description

The EN2340QI is a highly integrated, synchronous buck power supply module from Intel (formerly Enpirion), optimized to provide compact, high-efficiency power conversion for space-constrained systems. Delivering up to 4A continuous output current, the device integrates a PWM controller, power MOSFETs, an inductor, and all passive components into a single QFN package. This plug-and-play module simplifies design, reduces noise, and shortens time-to-market for modern embedded applications.

EN2340QI Features

High Integration: Fully integrated DC-DC converter (controller, MOSFETs, inductor, and passive components)

4A Continuous Output Current with peak efficiency over 90%

Wide Input Voltage Range: 2.7V to 5.5V

Adjustable Output Voltage: 0.75V to 3.3V

Fast Transient Response with low output ripple

Compact QFN Package: 9 x 6 x 1.85 mm

Protection Features: OVP, UVLO, SCP, and thermal shutdown

Low EMI Performance: Internal inductor minimizes radiated noise

Simplified PCB Layout: No external compensation or inductor required

EN2340QI Applications

FPGA and ASIC Core Power Rails

High-Density Embedded Systems

Networking and Telecommunications Equipment

Industrial Automation Devices

Medical and Test Instrumentation

Portable and Handheld Electronics

EN2340QI CAD Model

Footprint

EN2340QI Alternatives

If the EN2340QI is not available or doesn’t meet your requirements, consider these alternatives:

Texas Instruments TPSM846C23 – 35A PMBus Power Module with similar compact footprint.

Analog Devices LTM4624 – 4A µModule regulator with a wide input range and low noise.

Murata OKI-78SR – Compact switching regulator ideal for space-limited applications.

RECOM R-78C4.0-1.0 – Pin-compatible non-isolated switching regulator for lower-cost alternatives.

Vicor PI3325-00 – High-efficiency buck regulator for high-density power systems.

EN2340QI Internal Architecture Insights

Integrated Power Stage

The EN2340QI integrates both high-side and low-side power MOSFETs, along with the inductor, in a single QFN package. This minimizes parasitic inductance, reduces loop area, and improves EMI and efficiency.

EN2340QI Compensation Network

The EN2340QI features internal type III compensation, which supports a wide range of output capacitances without the need for external compensation components. This simplifies design and increases robustness.

Loop Bandwidth & Stability

With a high loop bandwidth, the converter responds quickly to load transients, minimizing output voltage deviation. It’s designed to maintain phase margin (>45° typical), which ensures system stability across various line/load conditions.

EN2340QI Electromagnetic Compatibility (EMC/EMI)

Low-EMI Design Techniques

The EN2340QI uses low-noise switching topology and internal layout techniques that reduce radiated and conducted emissions. It often complies with CISPR 22 Class B (with proper board layout and filtering).

Spread Spectrum Modulation (SSM)

Some similar Enpirion products feature optional spread-spectrum modulation to further suppress EMI peaks. While not always documented, this feature may be present or supported with configuration for EN2340QI.

EN2340QI System-Level Integration Tips

Startup Sequencing with Power Good (PG)

The EN2340QI includes a Power Good (PG) output signal to aid in sequencing power rails. PG goes high only when the output voltage is within regulation and the device is operating normally. This is useful for FPGAs or CPUs requiring staged startup.

Input Voltage Ripple Consideration

To avoid excessive ripple at VIN, it is recommended to place at least 3 × 10 µF ceramic capacitors (X7R, 0805 or 1206 size) as close as possible to the VIN and GND pins, along with a small bulk capacitor if needed (e.g., 10 µF tantalum or POSCAP).

Paralleling for Higher Current?

While the EN2340QI is not designed for direct parallel operation with current sharing, you can use multi-rail configurations (e.g., 3.3V + 5V + Vcore) for systems needing multiple voltages with individual rails.

EN2340QI Test & Debug Considerations

Ripple and Noise Testing

For accurate ripple measurement:

Use a ground spring on the oscilloscope probe.

Measure directly across the output ceramic capacitor closest to the module.

Avoid using long ground leads, which act as antennas and distort measurements.

Thermal Profiling Under Load

During load testing at >90% of rated output (i.e., over 5.5 A), use an IR camera or thermal probe to monitor the package surface. If temperature rises >125°C ambient, consider forced-air cooling or improving PCB thermal vias.

EN2340QI Evaluation & Design Resources (If Available)

Reference Designs: Intel/Enpirion often provides demo boards or Gerber files for layout replication.

Simulation Models: Request or download PSPICE or LTspice models for time-domain performance analysis and worst-case condition modeling.

PCB Layout Guidelines: Recommendations include using a solid ground plane, short traces between input caps and VIN, and avoiding vias in high-current paths.

EN2340QI Manufacturer

Intel Corporation is a world-leading multinational technology company headquartered in Santa Clara, California, USA. Founded in 1968 by Robert Noyce and Gordon Moore, Intel is best known for its role in pioneering the development of microprocessors, which power most of the world’s personal computers.

Intel designs and manufactures a broad range of semiconductors and computing technologies, including:

Central Processing Units (CPUs) for PCs, servers, and data centers

Chipsets, network interface controllers, and graphics

FPGAs (Field-Programmable Gate Arrays) and AI accelerators

System-on-chip (SoC) and embedded solutions

Non-volatile memory technologies like Optane

Intel's x86 microarchitecture has been the dominant architecture for decades across the computing ecosystem. The company has also made major strides in AI, autonomous driving (via Mobileye), 5G communications, and advanced semiconductor manufacturing.

In recent years, Intel has invested heavily in chip foundry services (Intel Foundry) to compete with companies like TSMC and Samsung, and has embraced hybrid architectures, integrating performance and efficiency cores in its processors (e.g., the Intel Core “Alder Lake” series and beyond).

With a vision to create world-changing technology that improves the life of every person on the planet, Intel continues to be a cornerstone in computing innovation, shaping everything from laptops and servers to the future of AI, edge computing, and quantum research.

EN2340QI FAQs

Question: What is the maximum output current supported by EN2340QI?

Answer: The EN2340QI supports up to 4A continuous output current, with current derating depending on ambient temperature and airflow.

Question: Can the EN2340QI be used for powering FPGAs or microcontrollers?

Answer: Yes, it is ideal for powering core rails of FPGAs, ASICs, and MCUs due to its fast transient response and adjustable output voltage.

Question: How does EN2340QI handle thermal performance in compact designs?

Answer: The EN2340QI includes thermal shutdown protection, and its exposed thermal pad helps with efficient heat dissipation in dense systems.

Question: Does EN2340QI require any external inductor or compensation circuitry?

Answer: No, the module is fully integrated, including the inductor and internal compensation, minimizing external component count and layout complexity.

Question: What’s the recommended input voltage range for the EN2340QI?

Answer: The EN2340QI operates efficiently with an input voltage range of 2.7V to 5.5V, making it suitable for 3.3V and 5V rail systems.