HPF-02-01-H-S

Samtec Inc.

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HPF-02-01-H-S

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Description:

.200 HI POWER SOCKET ASSEMBLY

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Update Time: 2024-07-19 18:04:22

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Mfr	Samtec Inc.
Style	Board to Board
Series	HPF
Package	Bulk
Features	-
Termination	Solder
Applications	-
Contact Type	Female Socket
Contact Shape	Square
Mounting Type	Through Hole
Connector Type	Receptacle
Fastening Type	Push-Pull
Number of Rows	1
Pitch - Mating	0.200" (5.08mm)
Product Status	Active
Voltage Rating	-
Contact Material	Beryllium Copper
Insulation Color	Black
Insulation Height	0.351" (8.92mm)
Ingress Protection	-
Base Product Number	HPF-02
Insulation Material	Liquid Crystal Polymer (LCP)
Number of Positions	2
Row Spacing - Mating	-
Contact Finish - Post	Gold
Contact Length - Post	0.102" (2.60mm)
Current Rating (Amps)	-
Operating Temperature	-
Mated Stacking Heights	-
Contact Finish - Mating	Gold
Number of Positions Loaded	All
Material Flammability Rating	-
Contact Finish Thickness - Post	-
Contact Finish Thickness - Mating	-