FI-XB30SSLA-HF15

JAE Electronics

Product No:

FI-XB30SSLA-HF15

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Manufacturer Standard Lead Time:

15 Weeks

Datasheet:

Description:

CONN RCPT 30P 0.039 GOLD SMD R/A

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Update Time: 2024-07-19 17:50:29

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Mfr	JAE Electronics
Style	Board to Cable/Wire
Series	FI-X
Package	Tape & Reel (TR)
Features	Grounding Pins, Shielded, Solder Retention
Termination	Solder
Applications	General Purpose
Contact Type	Non-Gendered
Contact Shape	-
Mounting Type	Board Cutout, Bottom Mount, Surface Mount, Right Angle
Connector Type	Receptacle
Fastening Type	Friction Lock
Number of Rows	1
Pitch - Mating	0.039" (1.00mm)
Product Status	Active
Voltage Rating	200V
Contact Material	Copper Alloy
Insulation Color	Beige
Insulation Height	-
Ingress Protection	-
Base Product Number	FI-XB30
Insulation Material	Plastic
Number of Positions	30
Row Spacing - Mating	-
Contact Finish - Post	Tin
Contact Length - Post	-
Current Rating (Amps)	1A per Contact
Operating Temperature	-40°C ~ 80°C
Mated Stacking Heights	-
Contact Finish - Mating	Gold
Number of Positions Loaded	All
Material Flammability Rating	UL94 V-0
Contact Finish Thickness - Post	-
Contact Finish Thickness - Mating	3.90µin (0.099µm)