CLP-111-02-L-D

Samtec Inc.

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CLP-111-02-L-D

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CONN RCPT 22POS 0.05 GOLD SMD

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Update Time: 2024-07-19 18:03:54

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Mfr	Samtec Inc.
Style	Board to Board
Series	CLP
Package	Bulk
Features	-
Termination	Solder
Applications	-
Contact Type	Female Socket
Contact Shape	Square
Mounting Type	Surface Mount
Connector Type	Receptacle
Fastening Type	Push-Pull
Number of Rows	2
Pitch - Mating	0.050" (1.27mm)
Product Status	Active
Voltage Rating	240VAC, 330VDC
Contact Material	Phosphor Bronze
Insulation Color	Black
Insulation Height	0.090" (2.29mm)
Ingress Protection	-
Base Product Number	CLP-111
Insulation Material	Liquid Crystal Polymer (LCP)
Number of Positions	22
Row Spacing - Mating	0.050" (1.27mm)
Contact Finish - Post	Tin
Contact Length - Post	-
Current Rating (Amps)	3.3A per Contact
Operating Temperature	-55°C ~ 125°C
Mated Stacking Heights	-
Contact Finish - Mating	Gold
Number of Positions Loaded	All
Material Flammability Rating	UL94 V-0
Contact Finish Thickness - Post	-
Contact Finish Thickness - Mating	10.0µin (0.25µm)