0447642001

Molex

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0447642001

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CONN RCPT 20P 0.118 TIN PCB R/A

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Update Time: 2024-07-19 17:56:31

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Mfr	Molex
Style	Board to Board or Cable
Series	Micro-Fit 3.0 BMI 44764
Package	Tray
Features	Blind Mating, Board Guide
Termination	Solder
Applications	General Purpose, Telecommunications
Contact Type	Female Socket
Contact Shape	Square
Mounting Type	Through Hole, Right Angle
Connector Type	Receptacle
Fastening Type	Push-Pull
Number of Rows	2
Pitch - Mating	0.118" (3.00mm)
Product Status	Active
Voltage Rating	600VAC
Contact Material	Phosphor Bronze
Insulation Color	Black
Insulation Height	0.402" (10.20mm)
Ingress Protection	-
Base Product Number	044764
Insulation Material	Liquid Crystal Polymer (LCP), Glass Filled
Number of Positions	20
Row Spacing - Mating	0.118" (3.00mm)
Contact Finish - Post	Tin
Contact Length - Post	0.155" (3.94mm)
Current Rating (Amps)	5A
Operating Temperature	-40°C ~ 105°C
Mated Stacking Heights	-
Contact Finish - Mating	Tin
Number of Positions Loaded	All
Material Flammability Rating	UL94 V-0
Contact Finish Thickness - Post	40.0µin (1.02µm)
Contact Finish Thickness - Mating	40.0µin (1.02µm)