HPF-18-02-TM-S-K
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HPF-18-02-TM-S-K

Samtec Inc.

Product No:

HPF-18-02-TM-S-K

Manufacturer:

Samtec Inc.

Package:

-

Manufacturer Standard Lead Time:

-

Datasheet:

-

Description:

.200 HI POWER SOCKET ASSEMBLY

Quantity:

Delivery:

1.webp 4.webp 5.webp 2.webp 3.webp

Payment:

paypal.webp paypal02.webp paypal03.webp paypal04.webp

In Stock : Please Inquiry

Update Time: 2023-12-11 10:24:48

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Product Information

Parameter Info

Product Details

User Guide

Mfr Samtec Inc.
Style Board to Board
Series HPF
Package Bulk
Features Pick and Place
Termination Solder
Applications -
Contact Type Female Socket
Contact Shape Square
Mounting Type Surface Mount
Connector Type Receptacle
Fastening Type Push-Pull
Number of Rows 1
Pitch - Mating 0.200" (5.08mm)
Product Status Active
Voltage Rating -
Contact Material Beryllium Copper
Insulation Color Black
Insulation Height 0.351" (8.92mm)
Ingress Protection -
Base Product Number HPF-18
Insulation Material Liquid Crystal Polymer (LCP)
Number of Positions 18
Row Spacing - Mating -
Contact Finish - Post Tin
Contact Length - Post -
Current Rating (Amps) -
Operating Temperature -
Mated Stacking Heights -
Contact Finish - Mating Tin
Number of Positions Loaded All
Material Flammability Rating -
Contact Finish Thickness - Post -
Contact Finish Thickness - Mating -