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EP2C70F896I8N FPGAs: Features, Alternatives and Datasheet

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  • Time of issue:2024-11-07
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EP2C70F896I8N FPGAs: Features, Alternatives and Datasheet

  • Categories:Company News
  • Author:
  • Origin:
  • Time of issue:2024-11-07
  • Views:0

EP2C70F896I8N Description

The EP2C70F896I8N is a high-density FPGA from the Cyclone II family, designed to provide cost-effective performance for a range of applications that require flexibility and processing capabilities. Built on a 90nm process, this FPGA offers a good balance between low power consumption and high functionality, with approximately 68,416 logic elements (LEs) and a robust set of embedded resources. The EP2C70F896I8N is often used in applications where high performance is essential, but space and power considerations are also important.

 

EP2C70F896I8N Features

Logic Elements (LEs): Offers 68,416 LEs, making it suitable for complex digital designs that need a high logic density.

Embedded Memory: Provides up to 1,152 Kbits of embedded memory, enhancing data storage and processing capabilities.

Multipliers for DSP Applications: Contains 150 embedded 18x18 multipliers, ideal for digital signal processing (DSP) tasks such as filtering and data transformation.

High-Speed I/O: Supports a range of I/O standards with a total of 622 user I/O pins, allowing for flexible data interfacing with other devices.

Clock Management: Equipped with multiple phase-locked loops (PLLs) for precise clocking and frequency control, critical for timing-sensitive applications.

Power-Efficient Design: Built to offer a balance between performance and power consumption, making it ideal for embedded systems.

FineLine BGA Package: Available in an 896-pin FineLine Ball Grid Array (BGA) package, which offers high pin density and compact design.

 

EP2C70F896I8N Applications

The EP2C70F896I8N FPGA is used in a wide range of applications across different industries:

Industrial Control Systems: Ideal for motor control, robotics, and automation systems that need real-time processing and control.

Digital Signal Processing (DSP): Used in signal filtering, data transformation, and image processing due to its embedded multipliers and memory resources.

Telecommunications and Networking: Commonly used in routers, switches, and base stations, where high-speed data processing and interfacing are required.

Prototyping and Emulation: Suitable for hardware design prototyping and emulation to verify designs before manufacturing.

Automotive Applications: Often applied in automotive electronics and infotainment systems due to its power efficiency and reliability.

 

EP2C70F896I8N Alternatives

If you're looking for similar FPGAs, consider the following alternatives:

EP2C50F672C8N A lower-density option in the Cyclone II family with fewer LEs (50,000) but similar architecture and features.

Cyclone III (e.g., EP3C120F780C7N) A higher-performance successor to the Cyclone II series, offering improved power efficiency and more logic elements.

Xilinx Spartan-3 XC3S5000-4FGG900C Comparable to the Cyclone II in terms of performance and cost, suitable for general-purpose FPGA applications.

Intel Cyclone IV (e.g., EP4CE115F29C7N) Provides higher performance and lower power consumption than the Cyclone II, with enhanced I/O and memory capabilities.

 

EP2C70F896I8N FAQs

What are the main features of the EP2C70F896I8N FPGA?

The EP2C70F896I8N offers 68,416 logic elements, 1,152 Kbits of embedded memory, 150 DSP multipliers, and high-speed I/O with 622 user pins in an 896-pin FineLine BGA package.

 

What development tools are compatible with the EP2C70F896I8N?

The EP2C70F896I8N is compatible with Intels Quartus II software, which supports design entry, synthesis, simulation, and programming in both VHDL and Verilog.

 

What type of applications is the EP2C70F896I8N suitable for?

This FPGA is ideal for industrial automation, DSP applications, telecommunications, automotive electronics, and hardware prototyping.

 

What power requirements does the EP2C70F896I8N have?

The EP2C70F896I8N requires a core voltage of 1.2V, with I/O voltages that typically range from 2.5V to 3.3V, depending on the specific I/O standards used.

 

What packaging and pin count does the EP2C70F896I8N use?

The EP2C70F896I8N comes in an 896-pin FineLine Ball Grid Array (BGA) package, which allows for a high pin density suitable for complex, high-performance applications.

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